General information | |||||||
Type | CPU / Microprocessor | ||||||
Market segment | Server | ||||||
Family | Intel Xeon E5-1600 v2 | ||||||
Model number | E5-1607 v2 | ||||||
CPU part number |
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Frequency | 3000 MHz | ||||||
Bus speed | 5 GT/s DMI | ||||||
Clock multiplier | 30 | ||||||
Package | 2011-land Flip-Chip Land Grid Array | ||||||
Socket | Socket 2011 / LGA2011 | ||||||
Size | 2.07″ x 1.77″ / 5.25cm x 4.5cm | ||||||
Introduction date | September 10, 2013 | ||||||
S-spec numbers | |||||||
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Architecture / Microarchitecture | |||||||
Microarchitecture | Ivy Bridge | ||||||
Processor core | Ivy Bridge-EP | ||||||
Core stepping | S1 (SR1B3) | ||||||
Manufacturing process | 0.022 micron | ||||||
Data width | 64 bit | ||||||
The number of cores | 4 | ||||||
The number of threads | 4 | ||||||
Floating Point Unit | Integrated | ||||||
Level 1 cache size | 4 x 32 KB instruction caches 4 x 32 KB data caches |
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Level 2 cache size | 4 x 256 KB | ||||||
Level 3 cache size | 10 MB | ||||||
Physical memory | 768 GB | ||||||
Multiprocessing | Uniprocessor | ||||||
Features |
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Low power features | Enhanced SpeedStep technology | ||||||
Integrated peripherals / components | |||||||
Integrated graphics | None | ||||||
Memory controller |
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Other peripherals |
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Electrical / Thermal parameters | |||||||
V core | 0.65V – 1.3V | ||||||
Maximum operating temperature | 70°C | ||||||
Thermal Design Power | 130 Watt | ||||||
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