| General information | |||||||
| Type | CPU / Microprocessor | ||||||
| Market segment | Server | ||||||
| Family | Intel Xeon E5-1600 v2 | ||||||
| Model number | E5-1607 v2 | ||||||
| CPU part number |
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| Frequency | 3000 MHz | ||||||
| Bus speed | 5 GT/s DMI | ||||||
| Clock multiplier | 30 | ||||||
| Package | 2011-land Flip-Chip Land Grid Array | ||||||
| Socket | Socket 2011 / LGA2011 | ||||||
| Size | 2.07″ x 1.77″ / 5.25cm x 4.5cm | ||||||
| Introduction date | September 10, 2013 | ||||||
| S-spec numbers | |||||||
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| Architecture / Microarchitecture | |||||||
| Microarchitecture | Ivy Bridge | ||||||
| Processor core | Ivy Bridge-EP | ||||||
| Core stepping | S1 (SR1B3) | ||||||
| Manufacturing process | 0.022 micron | ||||||
| Data width | 64 bit | ||||||
| The number of cores | 4 | ||||||
| The number of threads | 4 | ||||||
| Floating Point Unit | Integrated | ||||||
| Level 1 cache size | 4 x 32 KB instruction caches 4 x 32 KB data caches |
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| Level 2 cache size | 4 x 256 KB | ||||||
| Level 3 cache size | 10 MB | ||||||
| Physical memory | 768 GB | ||||||
| Multiprocessing | Uniprocessor | ||||||
| Features |
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| Low power features | Enhanced SpeedStep technology | ||||||
| Integrated peripherals / components | |||||||
| Integrated graphics | None | ||||||
| Memory controller |
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| Other peripherals |
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| Electrical / Thermal parameters | |||||||
| V core | 0.65V – 1.3V | ||||||
| Maximum operating temperature | 70°C | ||||||
| Thermal Design Power | 130 Watt | ||||||
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